설명
ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. nThe RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. nPerforms the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. nAll the processes are completed without moving the wafer on the same chuck table. nThe smallest footprint in the world. nEnvironmental - friendly - subsurface damage reduction without chemicals. nEnvironmental - friendly - subsurface damage reduction without chemicals.환경 설정
PG3000RM/200RMOEM 모델 설명
미제공문서
문서 없음
ACCRETECH / TSK
PG3000RM
검증됨
카테고리
Wafer Grinding
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
79210
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
PG3000RM
카테고리
Wafer Grinding
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
79210
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. nThe RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. nPerforms the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. nAll the processes are completed without moving the wafer on the same chuck table. nThe smallest footprint in the world. nEnvironmental - friendly - subsurface damage reduction without chemicals. nEnvironmental - friendly - subsurface damage reduction without chemicals.환경 설정
PG3000RM/200RMOEM 모델 설명
미제공문서
문서 없음