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환경 설정 없음OEM 모델 설명
The DISCO DFG8360 is a fully automatic in-feed surface grinder designed for precision thinning of semiconductor wafers. It features a two-spindle, two-chuck table configuration, enabling efficient grinding of wafers up to 8 inches in diameter. The grinder employs a diamond wheel with a diameter of 200 mm and operates with a spindle rated at 4.2 kW, offering a rotation speed range of 1,000 to 7,000 rpm. Its compact design measures 1,200 mm in width, 2,670 mm in depth, and 1,800 mm in height, with an approximate weight of 3,100 kg.문서
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DISCO
DFG8360
카테고리
Wafer Grinding
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
120970
웨이퍼 사이즈:
12"/300mm
빈티지:
2006
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설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The DISCO DFG8360 is a fully automatic in-feed surface grinder designed for precision thinning of semiconductor wafers. It features a two-spindle, two-chuck table configuration, enabling efficient grinding of wafers up to 8 inches in diameter. The grinder employs a diamond wheel with a diameter of 200 mm and operates with a spindle rated at 4.2 kW, offering a rotation speed range of 1,000 to 7,000 rpm. Its compact design measures 1,200 mm in width, 2,670 mm in depth, and 1,800 mm in height, with an approximate weight of 3,100 kg.문서
문서 없음