DISCO develops, manufactures, and sells precision machines and precision processing tools.

DISCO

DFG-81IF/8

2018
Developed DFG8640, a fully automatic grinder compatible with Φ8-inch wafers, which achieves high-precision processing of difficult-to-grind materials.

DFG8640

DFG871

The DISCO DFG8360 is a fully automatic in-feed surface grinder designed for precision thinning of semiconductor wafers. It features a two-spindle, two-chuck table configuration, enabling efficient grinding of wafers up to 8 inches in diameter. The grinder employs a diamond wheel with a diameter of 200 mm and operates with a spindle rated at 4.2 kW, offering a rotation speed range of 1,000 to 7,000 rpm. Its compact design measures 1,200 mm in width, 2,670 mm in depth, and 1,800 mm in height, with an approximate weight of 3,100 kg.

DFG8360

1987
Fully Automatic Surface Grinder DFG-82IF/8 developed.

DFG-82IF/8

DFG8390

The DISCO DFG8340 is a fully automatic in-feed surface grinder designed for high-precision wafer processing. It features a single spindle, dual chuck table, and single turntable structure, enabling efficient grinding of various workpieces up to 8 inches in diameter, including silicon wafers, SiC, sapphire, and ceramics. This grinder is particularly suitable for applications requiring high planarity, such as semiconductor device manufacturing.

DFG8340

1980
New rotary surface grinder DFG-83H/6, developed.

DFG-83H/6

2011
Developed the DFG8830, a grinder with a 4-axis and 5-chuck table configuration for hard and brittle materials such as sapphire and SiC.

DFG8830

DAG110

DFG830

DFG8541

The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.

DFG8540

The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.

DFG841

The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.

DAG810

The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.

DFG840

The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.

DFG8560

The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.

DFG850

DFG860

The DISCO DTG8440 is a fully automatic Taiko grinder manufactured by DISCO Corporation.

DISCO

개요

활성 등재물

총 제품 수

서비스

상위 DISCO Wafer Grinding

DFG8640

DFG830

DFG8541

DFG871

Moov에 등재하고 즉시 완벽한 구매자를 찾으십시오.

모든 DISCO Wafer Grinding