설명
12" Wafer Back Grinder GNX-300 L*W*H (cm) -140x255x180 �Weight (kg) -� 6000 1. Can't support 12" wafer 2. Unable to operate in products with a thickness of less than 300um. 3.Hub Port 4. CPU board환경 설정
환경 설정 없음OEM 모델 설명
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.문서
문서 없음
OKAMOTO
GNX 300
카테고리
Wafer Grinding
마지막 검증일: 13일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
143426
웨이퍼 사이즈:
12"/300mm
빈티지:
2003
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
12" Wafer Back Grinder GNX-300 L*W*H (cm) -140x255x180 �Weight (kg) -� 6000 1. Can't support 12" wafer 2. Unable to operate in products with a thickness of less than 300um. 3.Hub Port 4. CPU board환경 설정
환경 설정 없음OEM 모델 설명
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.문서
문서 없음