GNX-300
카테고리
Wafer Grinding개요
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.
활성 등재물
4
서비스
검사, 보험, 감정, 물류
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.
4
검사, 보험, 감정, 물류