설명
Weight: Grinding area section 5200 LBS = 2’358 kg Handling area section 2300 LBS = 1’043 kg Total weight 7500 LBS = 3 401 kg Footprint: Length: 66 in. (1676.5 mm) Depth: 84 in. (2133.5 mm) Height: 76 in. (2032 mm) Work Height: 39 in. (990.5 mm)환경 설정
환경 설정 없음OEM 모델 설명
"Advanced nTellect Wafer Grinder, 7AF, renowned for reducing sub-surface damage and improving surface finish with repeatable thickness control. The nTellect Grinder boasts high volume wafer throughput at a low cost, utilizing innovative technologies such as tapeless backgrinding, in-feed technology, in-situ thickness control, force adaptive grinding, linear traversing grind spindles, automated process control, and thin wafer handling. Serving a wide array of applications including integrated circuit backgrinding, silicon on insulator, prime wafers, gallium arsenide, lithium niobate, aluminum titanium carbide for read/write heads, glass, sapphire, and quartz, the nTellect Grinder relies on near-frictionless, force-sensitive infeed mechanics and an intelligent control system, which together increase wafer strength and reduce breakage. Its ultra-stiff air bearing spindles and sub-micron feed rates deliver superior surface finishes. The Grinder also features in-situ digital measurement probes and unique linear traversing grind spindles for optimized throughput and accurate, consistent wafer thicknesses. Lastly, with the addition of Tapeless Backgrinding and ultra-fine grit grind wheels, nTellect is poised to revolutionize thin wafer applications. "문서
문서 없음
카테고리
Wafer Grinding
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
149083
웨이퍼 사이즈:
알 수 없음
빈티지:
1999
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
STRASBAUGH
7AF
카테고리
Wafer Grinding
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
149083
웨이퍼 사이즈:
알 수 없음
빈티지:
1999
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Weight: Grinding area section 5200 LBS = 2’358 kg Handling area section 2300 LBS = 1’043 kg Total weight 7500 LBS = 3 401 kg Footprint: Length: 66 in. (1676.5 mm) Depth: 84 in. (2133.5 mm) Height: 76 in. (2032 mm) Work Height: 39 in. (990.5 mm)환경 설정
환경 설정 없음OEM 모델 설명
"Advanced nTellect Wafer Grinder, 7AF, renowned for reducing sub-surface damage and improving surface finish with repeatable thickness control. The nTellect Grinder boasts high volume wafer throughput at a low cost, utilizing innovative technologies such as tapeless backgrinding, in-feed technology, in-situ thickness control, force adaptive grinding, linear traversing grind spindles, automated process control, and thin wafer handling. Serving a wide array of applications including integrated circuit backgrinding, silicon on insulator, prime wafers, gallium arsenide, lithium niobate, aluminum titanium carbide for read/write heads, glass, sapphire, and quartz, the nTellect Grinder relies on near-frictionless, force-sensitive infeed mechanics and an intelligent control system, which together increase wafer strength and reduce breakage. Its ultra-stiff air bearing spindles and sub-micron feed rates deliver superior surface finishes. The Grinder also features in-situ digital measurement probes and unique linear traversing grind spindles for optimized throughput and accurate, consistent wafer thicknesses. Lastly, with the addition of Tapeless Backgrinding and ultra-fine grit grind wheels, nTellect is poised to revolutionize thin wafer applications. "문서
문서 없음