설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The EJD-9BL is a double-sided polishing machine that belongs to the EJD series. It supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover makes it suitable for use in a semiconductor manufacturing environment. Additionally, it comes with a variety of optional functions such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen. These features are essential for simultaneous double-sided polishing of thin wafers.문서
문서 없음
유사 등재물
모두 보기
ENGIS
EJD-9BL
카테고리
Wafer Lapping
마지막 검증일: 4일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
140381
웨이퍼 사이즈:
알 수 없음
빈티지:
2017
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The EJD-9BL is a double-sided polishing machine that belongs to the EJD series. It supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover makes it suitable for use in a semiconductor manufacturing environment. Additionally, it comes with a variety of optional functions such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen. These features are essential for simultaneous double-sided polishing of thin wafers.문서
문서 없음