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The DFP8140 is a fully automatic polisher made by DISCO Corporation. It is a dry polisher for Φ8-inch wafers with chemical-free stress relief. This dry polisher can remove the grinding damage layer on the backsides of wafers up to Φ8 inches without slurry. This process greatly reduces wafer breakage and warpage and improves die strength and product yield. The DFP8140 is designed to polish wafers of diameter Φ4/5/6/8 inch (select one size) using an anomalous in-feed grinding with wafer rotation method. It uses a Φ300 mm dry polishing wheel and a porous chuck table with vacuum chuck-method. The chuck table has a revolution speed range of 0-300 min-1 and is cleaned using water & air thrust up, leveling stone and brush cleaning. The spindle has an output of 4.8 kW and a revolution speed range of 1,000-4,000 min-1. The machine dimensions are 1,200 × 2,670 × 1,800 mm (W×D×H) and it weighs approximately 1,900 kg.