DGP8760
카테고리
Wafer Polishing개요
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.
활성 등재물
5
서비스
검사, 보험, 감정, 물류