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+DFM2700OEM 모델 설명
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.문서
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DISCO
DGP8760
카테고리
Wafer Polishing
마지막 검증일: 12일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
125959
웨이퍼 사이즈:
8"/200mm, 12"/300mm
빈티지:
2006
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설명
설명 없음환경 설정
+DFM2700OEM 모델 설명
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.문서
문서 없음