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설명
Multi-Process CMP환경 설정
Standard Features Include: - Automated control with soft touch key pad - Two platen process for post polish buff - Multiple slurry dispense - In-situ pad conditioner - Material compatibility for medium and low ph slurries (1 – 12) - Down force up to 750lbs. - Controllable wafer back pressure - Polish head clean station - External interface for end point capability Optional Features - Multizone ViPRR carrier upgrade - Temperature controlled platens - SECS II InterfaceOEM 모델 설명
미제공문서
문서 없음
카테고리
Wafer Polishing
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
83267
웨이퍼 사이즈:
8"/200mm
빈티지:
1997
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
IPEC / WESTECH
AVANTI 372M
카테고리
Wafer Polishing
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
83267
웨이퍼 사이즈:
8"/200mm
빈티지:
1997
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Multi-Process CMP환경 설정
Standard Features Include: - Automated control with soft touch key pad - Two platen process for post polish buff - Multiple slurry dispense - In-situ pad conditioner - Material compatibility for medium and low ph slurries (1 – 12) - Down force up to 750lbs. - Controllable wafer back pressure - Polish head clean station - External interface for end point capability Optional Features - Multizone ViPRR carrier upgrade - Temperature controlled platens - SECS II InterfaceOEM 모델 설명
미제공문서
문서 없음