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설명
설명 없음환경 설정
-Fully automated, dry-in/dry-out single wafer SiC substrate polisher -Configured for 150mm wafer processing -Milara, edge-contact dry robot on linear transfer platform -3 polish modules equipped with dedicated hardware -22" polish tables for constant-flow polish process -High pressure spray bar pad cleaner -Overam spindle with 4 passage rotary union -Slurry flow-controller for 2 lines per table -Integrated spray clean module with Jetspray and 2 fluid lines -Wet wafer transfer module with edge grip wafer flip robot to return wafer orientation to polish side up for cleaning -PEER Group, Windows based software architecture on a Beckhoff PLC control system with wafer lot and slot integrity -Semi S2, S8 and CE certification -Table temperture control unit -Universal Vacuum System -OCR camera -200mm wafer size conversion kit -6EZ Spare Parts KitOEM 모델 설명
미제공문서
문서 없음
REVASUM
6EZ
카테고리
Wafer Polishing
마지막 검증일: 29일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
108406
웨이퍼 사이즈:
알 수 없음
빈티지:
2020
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설명
설명 없음환경 설정
-Fully automated, dry-in/dry-out single wafer SiC substrate polisher -Configured for 150mm wafer processing -Milara, edge-contact dry robot on linear transfer platform -3 polish modules equipped with dedicated hardware -22" polish tables for constant-flow polish process -High pressure spray bar pad cleaner -Overam spindle with 4 passage rotary union -Slurry flow-controller for 2 lines per table -Integrated spray clean module with Jetspray and 2 fluid lines -Wet wafer transfer module with edge grip wafer flip robot to return wafer orientation to polish side up for cleaning -PEER Group, Windows based software architecture on a Beckhoff PLC control system with wafer lot and slot integrity -Semi S2, S8 and CE certification -Table temperture control unit -Universal Vacuum System -OCR camera -200mm wafer size conversion kit -6EZ Spare Parts KitOEM 모델 설명
미제공문서
문서 없음