설명

설명 없음

환경 설정

Scrubber 2F 3C2D 1. Equipment configuration: 8 inches Serial number Name Amount) 1 ID: Open cassette unit 4 2 TR：Transport Robot Wafer Transfer Arm 2 3 SD：Develop unit 2 4 SC: Coat unit 3 5 AH: HMDS Tackifier Unit 1 6 CP: Cool Plate 5 7 HP: Hot Plate (Hot Plate Oven Unit) 8 2. Equipment performance indicators: Serial number Project Describe 1 Open cassette unit Can hold 4 Cassttes; can automatically detect the wafer storage position The way to put in and out the flower basket and the order of taking out the flowers can be set 2 TR: Wafer Transfer Arm IDA robot wait to SD/SC/CP/HP/RO functional unit transmission 3 SD: Development chamber Wafer fixing method: vacuum adsorption. Development spray, pure water, back flushing 4 SC: Glue chamber Vacuum adsorption, 3 glue pumps, 2-way glue, EBR, back cleaning 5 Liquid supply system 1 set of automatic liquid supply; 6 Main control unit 1. 6 IDA, TR, SPIN, hot and cold plate unit control boards.2. SPIN servo controller 5 sets 3. TR robot drive box 2 sets 4. 1 main control computer, 1 human-machine interface screen 7 Equipment process menu Can edit and store 99 process menus (programs 1-99) 8 Computer host NEC 9821A Industrial Computer 9 Spin Motor Japan Yaskawa Association circulation servo motor: (0～8000)rpm adjustable Accuracy: 0-2000rpm, error: 0.05%; 2000- 5000rpm, error: 0.02% 10 Data monitoring Rinse 1 Nozzle, Rinse 2 Nozzle, Real-time flow monitoring/SPIN single Yuan 11 Wafer recycling system 1. After power off and restart, it can automatically detect whether there is silicon wafer and automatically put the silicon wafer Recycled into Cassette No. 1. 12 Robot position correction The up and down, front and back, and rotation positions of the robot can be set and recorded through data. Memory. Accuracy: 0.1mm. 13 HP Hot Plate Oven 23-250 degrees; accuracy ±0.5 degrees, process time adjustable, temperature compensated 14 CP Cold Plate Unit 23±0.5 degrees, process time adjustable, temperature compensated 3. Equipment power conditions: Device Name Project Describe Glue coating and developing machine SK-W80A-BVP Power Requirements 1φ100VAC, 5KW/14.5A; 1φ 200VAC, 2.4KW/3A 60HZ Environmental requirements Temperature: 23±5℃, humidity: less than 65% CDA Requirements 0.4-0.7mpa, 3m Vacuum requirements ≥ 45 mmHg N2 Requirements ≥0.7mpa, 2m³/h high purity nitrogen Heat exhaust 200m³/h Pure water requirements ≥0.2Mpa, 3m³/h