설명
설명 없음환경 설정
Two modules: -First module, the wafer is soaked in the mix of solvents (cleaning by submersion). -Second module, there is processing by spray solvents (Fan Spray Processing) and nitrogen drying stage. As solvents N- methylpyrrolidone (NMP) and isopropyl alcohol (IPA) were used. The unit has dry-in/dry-out system (dry wafers in/ dry wafers out)OEM 모델 설명
미제공문서
문서 없음
SSEC
3302
검증됨
카테고리
Wafer Scrubber
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
24600
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SSEC
3302
카테고리
Wafer Scrubber
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
24600
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Two modules: -First module, the wafer is soaked in the mix of solvents (cleaning by submersion). -Second module, there is processing by spray solvents (Fan Spray Processing) and nitrogen drying stage. As solvents N- methylpyrrolidone (NMP) and isopropyl alcohol (IPA) were used. The unit has dry-in/dry-out system (dry wafers in/ dry wafers out)OEM 모델 설명
미제공문서
문서 없음