설명

Two wafer processing modules, acid processing. Stainless steel construction. Two wafer elevators. PC controller. Currently configured for 200mm wafer sizes MFG Date: 2010 CE Marked (2) 200mm Horizontal Open Cassette stations Integrated wafer sensor & teaching system Non-contact wafer alignment system (optical alignment) Dual blade wafer handling robot (PVDF coated ceramic end-effectors) Process Stations: Molded (HALAR), Etch & Clean processing chambers WaferChek real-time process monitoring & control Chemical Delivery System: (3) Programmable fan dispense arms w/100% surface coverage ARM-1: DI:CO2 ARM-2: DI Rinse, Stream ARM-3: electronic, heated, filtered, N2 blow assist Programmable chamber wash w/DIW Chamber wall dispense w/adjustable nozzle Internal open & closed chemical collection ring (prog. separation, open, or closed) N2 or CDA Heater for gas seal spindle tooling Spindle system: programmable, brushless direct drive closed loop spin motor PC controlled chemical mixing for DI:CO2 solution Non-contact resistance monitor for fresh DI:CO2 dilution feedback PC programmable DI:CO2 re-circulation system DI:CO2 re-circulation cleanliness & temperature control (2) Automatic, programmable pressure & flow control systems – 1 per process chamber Programmable flow rate monitoring systems Programmable Chemical counting systems SQL Process view Package SECS II/GEM interface Host emulation software – SECS II/GEM data collection on local PC as “Host”

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OEM 모델 설명

the SSEC 3300 family of cutting-edge wet cleaners and processors. Engineered with singular wafer technology, these systems boast application-specific configurations catering to every facet of semiconductor fabrication – from meticulous cleaning and precise coating to intricate development, etching, and solvent processing – all within an entirely digital realm. Supporting wafers up to 300 mm, the Model 3301/2 variants stand as paragons of automation, ensuring operator safety even when handling the most aggressive chemistries through their dry-in/dry-out design. With the option to integrate up to two processing modules, flexibility meets efficiency. Choose between bulkhead or ballroom styles, both employing ULPA filtration to process air within the mini-environment, while the onboard bulk chemical management and blending capability enhances cost-effectiveness, enabling operations with chemistry diluted from concentrated bulk supplies. Adhering to SEMI® ergonomic standards, wafers can be deftly managed in cassettes using horizontal cassette loaders, SMIFs, or standard 300 mm FOUP openers. Redefine possibility – embrace the future with SSEC 3300.