설명
High pressure washing machine환경 설정
환경 설정 없음OEM 모델 설명
SSEC 3300 family of cutting-edge wet cleaners and processors, tailored to specific applications including cleaning, coating, developing, etching, and solvent processing, these systems operate within an entirely digital environment, ensuring unparalleled precision and efficiency. Engineered to accommodate wafers up to 300 mm or glass substrates up to 10" square, the Model 3300 ML configurations combine automated processing with manual loading, offering the utmost operator safety even when handling aggressive chemicals, thanks to their dry-in/dry-out design. Choose between bulkhead or ballroom styles, both featuring mini-environments upheld by ULPA filtration for pristine air quality. The chamber, hermetically sealed and backfilled with ULPA filtered air or inert gas, can house up to four drains and accommodate up to six arms—each boasting an array of dispenses, specialized nozzles, or brushes. Elevate your processing with in-situ monitoring and control, empowered by SSEC's exclusive WaferChek™ system, enabling meticulous command over process completion and meticulous logging of processing quality. Upgrade your semiconductor fabrication with the SSEC 3300, where innovation meets immaculate precision.문서
문서 없음
SSEC / VEECO
3300
검증됨
카테고리
Wafer Scrubber
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
110976
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
SSEC / VEECO
3300
카테고리
Wafer Scrubber
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
110976
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
High pressure washing machine환경 설정
환경 설정 없음OEM 모델 설명
SSEC 3300 family of cutting-edge wet cleaners and processors, tailored to specific applications including cleaning, coating, developing, etching, and solvent processing, these systems operate within an entirely digital environment, ensuring unparalleled precision and efficiency. Engineered to accommodate wafers up to 300 mm or glass substrates up to 10" square, the Model 3300 ML configurations combine automated processing with manual loading, offering the utmost operator safety even when handling aggressive chemicals, thanks to their dry-in/dry-out design. Choose between bulkhead or ballroom styles, both featuring mini-environments upheld by ULPA filtration for pristine air quality. The chamber, hermetically sealed and backfilled with ULPA filtered air or inert gas, can house up to four drains and accommodate up to six arms—each boasting an array of dispenses, specialized nozzles, or brushes. Elevate your processing with in-situ monitoring and control, empowered by SSEC's exclusive WaferChek™ system, enabling meticulous command over process completion and meticulous logging of processing quality. Upgrade your semiconductor fabrication with the SSEC 3300, where innovation meets immaculate precision.문서
문서 없음