설명
Bonding Accuracy Defect Detector환경 설정
환경 설정 없음OEM 모델 설명
The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography-relevant parameters like critical dimensions, as well as bond alignment accuracy. Because of the system’s high measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters. With its diverse measurement methods, the EVG40 NT adapts to a large number of manufacturing processes like nanoimprint lithography or wafer-to-wafer bonding simultaneously.문서
문서 없음
카테고리
Wafer Testing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
127034
웨이퍼 사이즈:
알 수 없음
빈티지:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG40 NT
카테고리
Wafer Testing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
127034
웨이퍼 사이즈:
알 수 없음
빈티지:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Bonding Accuracy Defect Detector환경 설정
환경 설정 없음OEM 모델 설명
The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography-relevant parameters like critical dimensions, as well as bond alignment accuracy. Because of the system’s high measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters. With its diverse measurement methods, the EVG40 NT adapts to a large number of manufacturing processes like nanoimprint lithography or wafer-to-wafer bonding simultaneously.문서
문서 없음