설명

설명 없음

환경 설정

Dimensions (basic system): Length: 2,580 mm / 101.5” Length incl. conveyor system: 3,580 mm / 141” Width: 1,525 mm / 60” Height: 1,800 mm / 70.8” Weight: approx. 1,100 kg / 2,400 lb. (without solder) Paint: RAL 7035 / RAL 7016 Conveyor system: Type: Pin and chain conveyor for pallets alternatively roller conveyor Conveyor angle: 0° fixed Pallet width: 50-400 mm / 2-15.7” (option: 50-500 mm / 2-19.7”) Pallet length: 120-500 mm / 4.7-19.7” (option: 120-600 mm / 4.7-23.6”) PCB top side clearance: max. 100 mm / 3.9” (measured from PCB bottom side) (max. 15 mm / 0.6” on the edge, optionally 18 mm / 0.7”) PCB bottom side clearance: max. 30 mm / 1.2” (subject to the soldering joint position) Clearance from PCB edge: 3 mm / 0.1” Conveyor height from floor: 850 mm / ±15 mm (33.5” / ±0.6”) Conveyor speed: approx. max. 10 m/min / 33 ft/min Positioning accuracy: ±0.25 mm / 0.01” Pallet / PCB weight: max. 5 kg / 11 lb. Flux module: Type: high-precision spray fluxer Positioning system: 2-axis (X/Y), servomotor driven Flux storage tank: 2 l Flux speed: 0.2 - 2.5 m/min / 0.65 - 8.2 ft/min Positioning speed: 0.2 - 15 m/min / 0.65 - 49.2 ft/min Positioning accuracy: ±0.25 mm / 0.01” Spray width (130 µm inner nozzle diameter): 3-6mm/0.1-0.2” Preheat module (basic system): Type: dynamic bottom side IR emitters Connected power: max. 10,200 W Solder module: Type: stainless steel solder pot, integrated in a 3-axis positioning system (X/Y/Z), servomotor driven Solder nozzle: single-point high-precision solder wave Smallest nozzle diameter: 4.5 mm / 0.2” further nozzles on request Clearance from PCB edge: 3 mm / 0.1” Solder wave height: max. 5 mm / 0.2” Solder volume: 10 kg / 22 lb. (when using Sn63Pb) Solder alloy: Sn63Pb37EQ, (especially suited for use with N2) lead-free alloys on request Solder temperature: max. 330°C / 626°F Warm-up time: 1.5 hours Soldering speed: 0.1 m/min / 0.3 ft/min Positioning speeds: X/Y-axis: 0.2-15m/min / 0.65-49ft/min Z-axis, 0.2 - 4 m/min / 0.65 - 13.2 ft/min Positioning accuracy: ±0.25 mm / ±0.01” Nitrogen technology: Nitrogen supply: to be supplied locally Nitrogen injection: N2-cover over the solder bath Required pressure: 3 bar (43.5 PSI) N2-consumption: approx. 2 m3/h / 2.6 yd3/h Required particle cleanliness: 5.0 on average Pneumatic system: Compressed air supply: to be supplied locally Required pressure: 6 bar (87 (PSI) Consumption: < 5 m3/h / < 6.5 yd3/h Control: Industrial-PC with multiprocessor control Process visualization Input of all process parameters 7 day time clock Machine status control Password function Recording of process data Electrical data: Power: 5-wire system, 3 x 230/400 V, N, PE Power tolerance range: +6 %, -10 % Frequency: 50 or 60 Hz Power consumption: max. 26 kW (basic system) Amperage: max. 39 A (basic system) Max. fuse rating: 3 x 50 A (slow blow) (basic system) Exhaust rating (basic system): Exhaust volume per stack: approx. 150 m3/h / 196 yd3/h Exhaust stack: 2 stacks, 150 mm (5.9”) O.D. each Environmental specifications (operation): Ambient temperature: 15 - 30°C (59 - 86°F) Noise level: Permanent sound level: < 60 dB (A)