설명
1. Only the two on the right side of the 8 chambers of the entire machine can be used, while the other chambers cannot be used; 2. Only one of the four ports can be used, while the other three cannot be used; 3. Left ECO cannot be used; 4. 4 CDS, left 1 cannot be used, and the remaining 3 are normal;환경 설정
환경 설정 없음OEM 모델 설명
The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.문서
문서 없음
LAM RESEARCH / SEZ
DV-PRIME
검증됨
카테고리
Wet Etch
마지막 검증일: 22일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
73723
웨이퍼 사이즈:
알 수 없음
빈티지:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / SEZ
DV-PRIME
카테고리
Wet Etch
마지막 검증일: 22일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
73723
웨이퍼 사이즈:
알 수 없음
빈티지:
2007
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
1. Only the two on the right side of the 8 chambers of the entire machine can be used, while the other chambers cannot be used; 2. Only one of the four ports can be used, while the other three cannot be used; 3. Left ECO cannot be used; 4. 4 CDS, left 1 cannot be used, and the remaining 3 are normal;환경 설정
환경 설정 없음OEM 모델 설명
The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.문서
문서 없음