설명
Etcher환경 설정
2 Chambers Chuck Size - 8" Open Cassette Port Brooks PRI Robot - LAUDA Heaters (QTY 6) - CHC (QTY 3)OEM 모델 설명
The SEZ 223 is a spin-processing system designed for high throughput cleaning and film removal applications for semiconductor wafer processing. It has a robot that transports 200mm wafers from four cassettes to two identical process chambers, capable of applying up to three chemicals each. The system has an object-oriented software architecture with a Sematech compliant GUI and Touch Screen. It also has options like Offline process editor, Mini-Environment, DIW-Ozone Processing, SMIF, AGV, Frontside handling, Film Removal End Point Detection, and more. It supports applications such as Copper Backside & Wraparound Clean, Other Backside Metal Cleans, Backside Film Removal, Wafer Reclaim, Post-etch Polymer Removal, Oxide Etching, and Post-CMP-Cleaning.문서
문서 없음
카테고리
Wet Etch
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
146874
웨이퍼 사이즈:
8"/200mm
빈티지:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
LAM RESEARCH / SEZ
SP223
카테고리
Wet Etch
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
146874
웨이퍼 사이즈:
8"/200mm
빈티지:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Etcher환경 설정
2 Chambers Chuck Size - 8" Open Cassette Port Brooks PRI Robot - LAUDA Heaters (QTY 6) - CHC (QTY 3)OEM 모델 설명
The SEZ 223 is a spin-processing system designed for high throughput cleaning and film removal applications for semiconductor wafer processing. It has a robot that transports 200mm wafers from four cassettes to two identical process chambers, capable of applying up to three chemicals each. The system has an object-oriented software architecture with a Sematech compliant GUI and Touch Screen. It also has options like Offline process editor, Mini-Environment, DIW-Ozone Processing, SMIF, AGV, Frontside handling, Film Removal End Point Detection, and more. It supports applications such as Copper Backside & Wraparound Clean, Other Backside Metal Cleans, Backside Film Removal, Wafer Reclaim, Post-etch Polymer Removal, Oxide Etching, and Post-CMP-Cleaning.문서
문서 없음