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설명
설명 없음환경 설정
-400v -75A -50/60HZ Technical Data: -Dimension WxDxH: 2800x4150x2450 mm -Handling Device: Dual Arm Robot on Linear Tracking System -Process Chambers: Four Multi-Level Process Chambers double sided wafer treatment -Chemical Cabinet: Integrated in Main Unit -Software: Windows NTOEM 모델 설명
The SEZ 4300 is a 300mm single wafer processing system that combines SEZ’s process capability with high reliability and throughput. It uses a dual arm robot to transport wafers from four FOUPs to four process chambers, where two media (acid or solvent) can be used. The media can be recycled, heated, and filtered within the system or used in single pass mode. The system has an object-oriented software architecture with a Sematech compliant GUI and touch screen for easy operation. It offers a cost-effective throughput/footprint ratio and competitive CoO. Options like EPD and ozone processing are available to meet customer needs. Supported applications include etching for structuring, layer thinning, and layer stripping.문서
문서 없음
카테고리
Wet Etch
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
59806
웨이퍼 사이즈:
12"/300mm
빈티지:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / SEZ
SP4300
카테고리
Wet Etch
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
59806
웨이퍼 사이즈:
12"/300mm
빈티지:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
-400v -75A -50/60HZ Technical Data: -Dimension WxDxH: 2800x4150x2450 mm -Handling Device: Dual Arm Robot on Linear Tracking System -Process Chambers: Four Multi-Level Process Chambers double sided wafer treatment -Chemical Cabinet: Integrated in Main Unit -Software: Windows NTOEM 모델 설명
The SEZ 4300 is a 300mm single wafer processing system that combines SEZ’s process capability with high reliability and throughput. It uses a dual arm robot to transport wafers from four FOUPs to four process chambers, where two media (acid or solvent) can be used. The media can be recycled, heated, and filtered within the system or used in single pass mode. The system has an object-oriented software architecture with a Sematech compliant GUI and touch screen for easy operation. It offers a cost-effective throughput/footprint ratio and competitive CoO. Options like EPD and ozone processing are available to meet customer needs. Supported applications include etching for structuring, layer thinning, and layer stripping.문서
문서 없음