설명
Wafer clean system환경 설정
(4) LP (12) Chambers DSP DHF IPA DIW Filter BoxOEM 모델 설명
CELLESTA™ -i for 300mm wafer surface clean processing system provides enhanced productivity and significantly decreased footprint. The system incorporates up to twenty units of cleaning chambers and has much smaller footprint. Furthermore, it is equipped with integrated chemical recycle technology contributing less CoO, physical cleaning function for the particle removal on wafers; all of these functions contribute to achieve higher productivity. Additionally, this platform has excellent system extendibility, which is able to equip advanced bevel clean unit dedicated to wafer periphery and backside clean unit with less chemical consumption. 300mm wafer cleaning system, wet etch, uses hot IPA dry, can hold up to 20 cleaning chambers, 1000 wph throughput, can have bevel clean unit.문서
문서 없음
카테고리
Wet Etch
마지막 검증일: 12일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
152799
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
TEL / TOKYO ELECTRON
CELLESTA-i
카테고리
Wet Etch
마지막 검증일: 12일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
152799
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Wafer clean system환경 설정
(4) LP (12) Chambers DSP DHF IPA DIW Filter BoxOEM 모델 설명
CELLESTA™ -i for 300mm wafer surface clean processing system provides enhanced productivity and significantly decreased footprint. The system incorporates up to twenty units of cleaning chambers and has much smaller footprint. Furthermore, it is equipped with integrated chemical recycle technology contributing less CoO, physical cleaning function for the particle removal on wafers; all of these functions contribute to achieve higher productivity. Additionally, this platform has excellent system extendibility, which is able to equip advanced bevel clean unit dedicated to wafer periphery and backside clean unit with less chemical consumption. 300mm wafer cleaning system, wet etch, uses hot IPA dry, can hold up to 20 cleaning chambers, 1000 wph throughput, can have bevel clean unit.문서
문서 없음