설명
Single-wafer wet cleaning system환경 설정
Process: Single-spin process 3-layer, 12-chamber structure with individual process module controllers Throughput: 420 wafers/hour with 100-second process Supported chemicals: APM / DSP / DHF / IPA / H-IPA Nano-spray cleaning IPA drying Load ports: (4) FOUP in/out ports N₂ purge Wafer handling: 4-arm index transfer robot 4-arm process transfer robot Wafer recovery function for abnormal process conditions Antistatic chuck pins and support pins CO₂-DIW electrostatic discharge control Process performance: Particle performance: ≤20 particles at 45 nm on silicon wafer IPA Rotagoni dryer particle performance: ≤30 particles at 19 nm Front-side uniformity: ≤2% Back-side uniformity: ≤3% Applications: DSP / APM / DHF / IPA cleaning processes DIFF / DEPO pre-clean Oxide etch clean ETCH / CMP post-clean Metal-layer etch clean Airflow and exhaust: Downflow FFU exhaust system Particle removal and suppression in wafer transfer and process zones Automatic exhaust-pressure damper control Construction: Chemical-contact components: PTFE and PFA Non-chemical-contact components: PVC Wafer transfer zone: Antistatic PVC Chemical management: Chemical circulation filter installed in CDS Inlet filter: Optional Chemical mixing-ratio monitoring Monitoring and data: FDC data Daily wafer production count Alarm history viewing and analysis CCTV recording of each chamber and wafer transfer module for wafer-breakage analysis Safety: Pressure resistance Corrosion resistance Heat resistance Interlocks External light-and-sound signal towerOEM 모델 설명
The NAURA 3120G is a high-end, 12-inch front-end single-wafer cleaning equipment manufactured by NAURA Technology Group. It is primarily utilized in the semiconductor manufacturing sector for integrated circuit (IC) front-end cleaning processes.문서
문서 없음
카테고리
Wet Processing / Wafer Cleaning
마지막 검증일: 6일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
152936
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
NAURA / AKRION / NORTH MICROELETRONICS
3120G
카테고리
Wet Processing / Wafer Cleaning
마지막 검증일: 6일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
152936
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Single-wafer wet cleaning system환경 설정
Process: Single-spin process 3-layer, 12-chamber structure with individual process module controllers Throughput: 420 wafers/hour with 100-second process Supported chemicals: APM / DSP / DHF / IPA / H-IPA Nano-spray cleaning IPA drying Load ports: (4) FOUP in/out ports N₂ purge Wafer handling: 4-arm index transfer robot 4-arm process transfer robot Wafer recovery function for abnormal process conditions Antistatic chuck pins and support pins CO₂-DIW electrostatic discharge control Process performance: Particle performance: ≤20 particles at 45 nm on silicon wafer IPA Rotagoni dryer particle performance: ≤30 particles at 19 nm Front-side uniformity: ≤2% Back-side uniformity: ≤3% Applications: DSP / APM / DHF / IPA cleaning processes DIFF / DEPO pre-clean Oxide etch clean ETCH / CMP post-clean Metal-layer etch clean Airflow and exhaust: Downflow FFU exhaust system Particle removal and suppression in wafer transfer and process zones Automatic exhaust-pressure damper control Construction: Chemical-contact components: PTFE and PFA Non-chemical-contact components: PVC Wafer transfer zone: Antistatic PVC Chemical management: Chemical circulation filter installed in CDS Inlet filter: Optional Chemical mixing-ratio monitoring Monitoring and data: FDC data Daily wafer production count Alarm history viewing and analysis CCTV recording of each chamber and wafer transfer module for wafer-breakage analysis Safety: Pressure resistance Corrosion resistance Heat resistance Interlocks External light-and-sound signal towerOEM 모델 설명
The NAURA 3120G is a high-end, 12-inch front-end single-wafer cleaning equipment manufactured by NAURA Technology Group. It is primarily utilized in the semiconductor manufacturing sector for integrated circuit (IC) front-end cleaning processes.문서
문서 없음