설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Spray Solvent Tool (SST) is a compact, efficient system that enhances chemical reactions on wafer surfaces. It employs mechanical and centrifugal forces to achieve uniform coverage on both sides of the wafer. The closed loop process control ensures consistent results, while continuous recycling and filtration of chemicals reduce waste. The SST offers precise temperature control and flexibility in chemical delivery methods. With its high throughput, small footprint, and operator safety features, it provides reliable and low-maintenance operation. The tool supports various processes, including GaAs clean, metal lift-off, photoresist removal, post-etch residue removal, and thin film heads. It utilizes technologies such as copper RDL and pillar structures. Flexibility - featuring two, four, or seven tank configuration in small footprint cabinet; process chambers, product carriers, and quick-disconnect rotors are available for wafers up to 200mm문서
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SEMITOOL
SST 742
검증됨
카테고리
Wet processing
마지막 검증일: 14일 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
104065
웨이퍼 사이즈:
8"/200mm
빈티지:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMITOOL
SST 742
카테고리
Wet processing
마지막 검증일: 14일 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
104065
웨이퍼 사이즈:
8"/200mm
빈티지:
2005
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Spray Solvent Tool (SST) is a compact, efficient system that enhances chemical reactions on wafer surfaces. It employs mechanical and centrifugal forces to achieve uniform coverage on both sides of the wafer. The closed loop process control ensures consistent results, while continuous recycling and filtration of chemicals reduce waste. The SST offers precise temperature control and flexibility in chemical delivery methods. With its high throughput, small footprint, and operator safety features, it provides reliable and low-maintenance operation. The tool supports various processes, including GaAs clean, metal lift-off, photoresist removal, post-etch residue removal, and thin film heads. It utilizes technologies such as copper RDL and pillar structures. Flexibility - featuring two, four, or seven tank configuration in small footprint cabinet; process chambers, product carriers, and quick-disconnect rotors are available for wafers up to 200mm문서
문서 없음