설명
IPC-PM05 ASM TECH - GOLD WIRE BALL BONDER환경 설정
환경 설정 없음OEM 모델 설명
The Eagle AERO opens a new dimension in high-end IC applications. Thanks to its innovative bonding process (X-Power), copper wire connections can be generated 30 percent faster than with previous bonders. The Eagle AERO can create up to 24 2-millimeter connections per second with a bonding accuracy to 2,0 μm at 3 σ and a ball size that can be reduced to 22 μm.문서
문서 없음
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 6일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
152922
웨이퍼 사이즈:
알 수 없음
빈티지:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
ASM
Eagle AERO
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 6일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
152922
웨이퍼 사이즈:
알 수 없음
빈티지:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
IPC-PM05 ASM TECH - GOLD WIRE BALL BONDER환경 설정
환경 설정 없음OEM 모델 설명
The Eagle AERO opens a new dimension in high-end IC applications. Thanks to its innovative bonding process (X-Power), copper wire connections can be generated 30 percent faster than with previous bonders. The Eagle AERO can create up to 24 2-millimeter connections per second with a bonding accuracy to 2,0 μm at 3 σ and a ball size that can be reduced to 22 μm.문서
문서 없음