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GoCu Xpress Gold Wire Ball Bonder Standard Machine features and system description  Ultra-fine pitch and small ball bonding capabilities  High frequency transducer operating at 138 kHz  Applicable wire size of 0.6 - 2.0mil  High speed XY table with linear motor technology  XY table acceleration up to 10G with positional accuracy of + 1 um  Compact, low moving mass & low inertia bond head with built in force sensor  High accuracy work holder with linear indexer  Multiple magazine input / output elevator system  Motorized user programmable heater block and window clamp  Light weight voice-coil wire clamp assembly  Strong window clamp force  Programmable threshold for jam protection  CCD camera with RR-mode capability and dual magnification optics  Individual target point programmable coaxial and ring LED lighting system  Optical system optimized with ZEMAX design software for ultra-fine pitch bonding  Built-in online Vision Inspection System  Real time monitoring of bonding parameters bond force, bond power and position  Intelligent looping control incorporates auto tuning technology for loop trajectory  profiling  Loop profiles to cover low loop, square loop, normal reverse, ground and J-wire looping  Multiple bond level up to 5 level variations  Enhanced EFO and non-stick detection control  Real time monitoring of FAB  Post-bond monitoring module (post bond inspection & statistical management system)  Menu and graphics driven man-machine interface  Small footprint for improved output per square floor area  Combined hard disk and USB port for data and program storage

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The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.