설명

Base System, plus itemized options as listed below: - Bond process Control System BPC2000 Option - Deep Access Thin Wire bond head option - Thin Wire Spool Option - BPD Viewer Option Base System: - Standard bonding area X/Y: 254mm x 152mm (10” x 6”) Modular machine concept including: - Main components - Extremely rugged machine frame - Minimum dimensions of required floor space: 1777mm x 620mm x 1273mm - (height x width x depth) - Working height adjustable from 850mm -1050mm, fulfil SMEMA requirement (940-965 mm) - Control and power electronics based on industry standards - Pentium®M based cPCI CPU Unix® - Based real time multi - Tasking operating system - High capacity hard disk drive (>60 GB, ruggedised system) - Standard network connectivity TCP/IP, SMEMA, SECS/GEM (SEMI E30), HSMS graphical multi - window user interface - 19“ TFT flat screen monitor - Menu controlled teach-in - Direct parameter input - Pattern recognition display - Process status & message display - Service interface - Linear drive X -Y table with 10“ x 6“ bond area - X = 254 mm (10”); Y = 152 mm (6”); Z = 40 mm - High resolution linear encoders in X and Y - AC servo motor with absolute encoder in Z and P axes - High speed numeric control system - Programmable dual source work area lighting - Electronic touch down sensor for every bond - Individual height sensing per component or bond pad Microscope: - Stereo zoom - Adjustable - Light intensity - Status Light - Easy programmable Ultrasonic Generator: - Digital F&K Delvotec ultrasonic system - Voltage, current or power controlled - Programmable from 30 to 250 kHz operating frequency - Up to 40 watts ultrasonic power output Pattern recognition unit PRU: - CCD camera with custom optics adapted to product - Moving camera in Z axis - Programmable focus for each recognition point - Cognex®8000 Pat Max®system - 256 grayscale processing - Pattern recognition - Edge recognition - Tilted image option - Programmable size search window - 640 x 480 Pixel Camera - Process adjustment - Programme complexity virtually unlimited - Up to 150 chips recognition reference images - Up to 50.000 wires - No restriction on bond height within work area - Programmable force / time ramp - Bond parameter settings - Offset values per program - Standard values per chip - Individual settings per bond - Loop shape settings - Automatic or programmed loop height setting - Automatic control of bond height - Standard values per program - Standard values per chip - Individual settings per wire work area lighting - Program controlled type and intensity - Direct red LED standard

환경 설정

F&K Delvotec G5 - Single

OEM 모델 설명

F&K Delvotec G5 is a fully automatic all-in-one wire bonder. The compact, space saving G5 single wire bonder is truly a multi-talent. Within minutes it can be changed to all common bonding processes. For highest productivity with lowest operating costs applications specialists from F&K determine the level of automation required for the customer’s product exactly."