설명
설명 없음환경 설정
HBK 07 Bondhead (backcut) with active knife, 60 kHz transducer Ribbon size: 0.075 x 0.75 mm to 0.3 x 2 mm Wire diameter range: 100 µm to 500 µm Working area 350mm x 500mm (13.8" x 19.7") Bondheads for thick wire and ribbon applications Repeatability of the axes: 2 μm at 3 Sigma Wire spool, 4", motor driven Wire control and wire consumption measurement Active cutting system 4-Axis (X, Y, Z Theta) (3) Linear motors (2) Brushless servomotors Mini CCD camera with optics unit TFT Monitor High-res automatic image processing system 32-Bit digital I/O interface, electrically isolated, 24 V Keyboard and trackball Quality controller Microscope Enclosure incl. security system Bonding process: Aluminum Gold Copper wire Consumables: (4) Wedge tools for 200μm wires (50) Wire guides (9) Backcuts Power supply: 230 V, 50/60 HzOEM 모델 설명
Introducing Bondjet BJ939: Fully Automatic Heavy Wire Bonders by Hesse GmbH, equipped with unique features. Non-destructive pull test & transducer sensor ensure real-time quality monitoring. High speed, largest bonding area, and advanced programmable features enhance productivity. Up to 3 wires/s, 2 μm at 3 σ repeatability, and integrated quality control for precise results.문서
문서 없음
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 14일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
145514
웨이퍼 사이즈:
알 수 없음
빈티지:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
HESSE & KNIPPS
BONDJET 939
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 14일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
145514
웨이퍼 사이즈:
알 수 없음
빈티지:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
HBK 07 Bondhead (backcut) with active knife, 60 kHz transducer Ribbon size: 0.075 x 0.75 mm to 0.3 x 2 mm Wire diameter range: 100 µm to 500 µm Working area 350mm x 500mm (13.8" x 19.7") Bondheads for thick wire and ribbon applications Repeatability of the axes: 2 μm at 3 Sigma Wire spool, 4", motor driven Wire control and wire consumption measurement Active cutting system 4-Axis (X, Y, Z Theta) (3) Linear motors (2) Brushless servomotors Mini CCD camera with optics unit TFT Monitor High-res automatic image processing system 32-Bit digital I/O interface, electrically isolated, 24 V Keyboard and trackball Quality controller Microscope Enclosure incl. security system Bonding process: Aluminum Gold Copper wire Consumables: (4) Wedge tools for 200μm wires (50) Wire guides (9) Backcuts Power supply: 230 V, 50/60 HzOEM 모델 설명
Introducing Bondjet BJ939: Fully Automatic Heavy Wire Bonders by Hesse GmbH, equipped with unique features. Non-destructive pull test & transducer sensor ensure real-time quality monitoring. High speed, largest bonding area, and advanced programmable features enhance productivity. Up to 3 wires/s, 2 μm at 3 σ repeatability, and integrated quality control for precise results.문서
문서 없음