AT PREMIER
개요
The AT Premier is targeted for gold-to-gold interconnect in the growing flip chip market. With industry leading speed and technology, the machine lowers the cost of ownership for stud bumping, enabling a wider range of applications than previously served.
활성 등재물
4
서비스
검사, 보험, 감정, 물류
상위 등재물
KULICKE & SOFFA (K&S)
AT PREMIER
Wire / Wedge / Ball Bonder빈티지: 2010조건: 중고마지막 검증일30일 이상 전KULICKE & SOFFA (K&S)
AT PREMIER
Wire / Wedge / Ball Bonder빈티지: 2010조건: 중고마지막 검증일16일 전KULICKE & SOFFA (K&S)
AT PREMIER
Wire / Wedge / Ball Bonder빈티지: 조건: 중고마지막 검증일60일 이상 전KULICKE & SOFFA (K&S)
AT PREMIER
Wire / Wedge / Ball Bonder빈티지: 2007조건: 중고마지막 검증일60일 이상 전
