설명
WIRE BOND환경 설정
환경 설정 없음OEM 모델 설명
"The Maxµm ultra performs 10% faster than its predecessor, the industry-leading Maxµm plus™. The Maxµm ultra incorporates many technological advancements, making it the premier choice for today's complex packaging applications. A new bond force control system with piezo sensor technology allows for increased bond head velocity without increasing tool impact force. A new microprocessor control system provides for faster processing power as well as PC-style USB functionality for easier software and data handling. An enhanced wire feed/tensioning system reduces friction on the wire feed path for looping consistency at higher speeds. Bond Force Control System with Piezo Sensor Technology Advanced Low Friction Wire Feed System Fully Programmable BITS System Latest PC-based Processing Power Small Ball Detection Maxµm ultra Enhanced Performance UPH +10% over the Maxµm plus ±2.5µm Accuracy for 35µm Pitch Production Copper Wire Bonding Capable Wire Bonder문서
문서 없음
KULICKE & SOFFA (K&S)
Maxµm Ultra
검증됨
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 4일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
118065
웨이퍼 사이즈:
알 수 없음
빈티지:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
KULICKE & SOFFA (K&S)
Maxµm Ultra
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 4일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
118065
웨이퍼 사이즈:
알 수 없음
빈티지:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
WIRE BOND환경 설정
환경 설정 없음OEM 모델 설명
"The Maxµm ultra performs 10% faster than its predecessor, the industry-leading Maxµm plus™. The Maxµm ultra incorporates many technological advancements, making it the premier choice for today's complex packaging applications. A new bond force control system with piezo sensor technology allows for increased bond head velocity without increasing tool impact force. A new microprocessor control system provides for faster processing power as well as PC-style USB functionality for easier software and data handling. An enhanced wire feed/tensioning system reduces friction on the wire feed path for looping consistency at higher speeds. Bond Force Control System with Piezo Sensor Technology Advanced Low Friction Wire Feed System Fully Programmable BITS System Latest PC-based Processing Power Small Ball Detection Maxµm ultra Enhanced Performance UPH +10% over the Maxµm plus ±2.5µm Accuracy for 35µm Pitch Production Copper Wire Bonding Capable Wire Bonder문서
문서 없음