설명
Bonds fine wires in the range of .5 mil (12 microns) to 2 mil (50 microns) by the popular thermocompression technique. This machine is the standard in the industry for bonding extremely small geometries and particularly GASFET devices. Operator has finite control of the bonding tool down to the last instant of positioning over the bond targets.환경 설정
환경 설정 없음OEM 모델 설명
Wire Bonder문서
문서 없음
WESTBOND
7416A
카테고리
Wire / Wedge / Ball Bonder
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
125444
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Bonds fine wires in the range of .5 mil (12 microns) to 2 mil (50 microns) by the popular thermocompression technique. This machine is the standard in the industry for bonding extremely small geometries and particularly GASFET devices. Operator has finite control of the bonding tool down to the last instant of positioning over the bond targets.환경 설정
환경 설정 없음OEM 모델 설명
Wire Bonder문서
문서 없음