설명
Asset Description: THK28002-T - BRUKER D8 FABLINE (MT)- Software Version: 77-2.3A-6A-5A-5A-RR6A CIM: E84, SECS/GEM, GEM300 Process: XRD - Bruker환경 설정
Hardware Configuration System Type Description Quantity Main System D* Fabline (Bruker) 1 Factory Interface FOUP 2 Others Options System LynxEye Detector for secondary side + mount 1 Options System Keyence Laser Triangulation Module 1 for Fast Height Alignment Options System Pattern Recognition Software 1 Options System Wafer Chuck 1 Handler System Standard Automation and SW 1OEM 모델 설명
The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.문서
문서 없음
카테고리
X-Ray / XRD / XRF
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
136273
웨이퍼 사이즈:
12"/300mm
빈티지:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
BRUKER
D8 FABLINE
카테고리
X-Ray / XRD / XRF
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
136273
웨이퍼 사이즈:
12"/300mm
빈티지:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Asset Description: THK28002-T - BRUKER D8 FABLINE (MT)- Software Version: 77-2.3A-6A-5A-5A-RR6A CIM: E84, SECS/GEM, GEM300 Process: XRD - Bruker환경 설정
Hardware Configuration System Type Description Quantity Main System D* Fabline (Bruker) 1 Factory Interface FOUP 2 Others Options System LynxEye Detector for secondary side + mount 1 Options System Keyence Laser Triangulation Module 1 for Fast Height Alignment Options System Pattern Recognition Software 1 Options System Wafer Chuck 1 Handler System Standard Automation and SW 1OEM 모델 설명
The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.문서
문서 없음