설명
설명 없음환경 설정
-AXIS Active Image Stabilisation -XiDAT 2.0 imaging chain -Up to 70 degree oblique angle views over the entire inspection area -Enhanced automated inspection routines -Automatic BGA and die-void measurements -Comprehensive data logging and reporting facilities -Uninterrupted rotating live oblique views 360 degrees around any point in the sampleOEM 모델 설명
The Dage XD7600NT is an X-ray inspection system that provides oblique angle viewing of up to 70-degrees for any position 360-degrees around any point of the entire 18” x 16” (458 x 407 mm) inspection area allowing the XD7600NT to inspect all interconnections and PCBs containing BGA and CSP devices. It has a standard 2.0 mega pixel imaging system and can be equipped with a computerized tomography (CT) option providing 3D modeling and volumetric measurement of solder joints.문서
문서 없음
NORDSON / DAGE
XD7600NT
검증됨
카테고리
X-Ray / XRD / XRF
마지막 검증일: 10일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
114028
웨이퍼 사이즈:
알 수 없음
빈티지:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
NORDSON / DAGE
XD7600NT
카테고리
X-Ray / XRD / XRF
마지막 검증일: 10일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
114028
웨이퍼 사이즈:
알 수 없음
빈티지:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
-AXIS Active Image Stabilisation -XiDAT 2.0 imaging chain -Up to 70 degree oblique angle views over the entire inspection area -Enhanced automated inspection routines -Automatic BGA and die-void measurements -Comprehensive data logging and reporting facilities -Uninterrupted rotating live oblique views 360 degrees around any point in the sampleOEM 모델 설명
The Dage XD7600NT is an X-ray inspection system that provides oblique angle viewing of up to 70-degrees for any position 360-degrees around any point of the entire 18” x 16” (458 x 407 mm) inspection area allowing the XD7600NT to inspect all interconnections and PCBs containing BGA and CSP devices. It has a standard 2.0 mega pixel imaging system and can be equipped with a computerized tomography (CT) option providing 3D modeling and volumetric measurement of solder joints.문서
문서 없음