설명
Bruker D8 Fabline환경 설정
- Handler System: Automation software PTO from Peer Group - Pattern recognition software - Software Version: 77-2.3A-6A-5A-5A-R6A - Primary optics for micro diffraction, TXS X-ray system - Scanning range of two theta: min. 28° – max. 99°, Omega is limited to min. 30° max. 80° to avoid collision with 300mm wafer chuck - Stage is multi-sample holder (D8 FABLINE is designed for automated process and equipped only with wafer chuck for 300mm and standard Bruker sample holder for adjustment) - Motorized slits and fixed slit 2mm primary side (tube), secondary side LynxEye XE Detector - Wafer chuck and standard sample holder - Fully automated - X-ray source: TXS point focus (50kV 50mA) generator installed in the electronic cabinet behind the toolOEM 모델 설명
The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.문서
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BRUKER
D8 FABLINE
검증됨
카테고리
X-Ray
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
84211
웨이퍼 사이즈:
12"/300mm
빈티지:
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
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BRUKER
D8 FABLINE
카테고리
X-Ray
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
84211
웨이퍼 사이즈:
12"/300mm
빈티지:
2015
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Bruker D8 Fabline환경 설정
- Handler System: Automation software PTO from Peer Group - Pattern recognition software - Software Version: 77-2.3A-6A-5A-5A-R6A - Primary optics for micro diffraction, TXS X-ray system - Scanning range of two theta: min. 28° – max. 99°, Omega is limited to min. 30° max. 80° to avoid collision with 300mm wafer chuck - Stage is multi-sample holder (D8 FABLINE is designed for automated process and equipped only with wafer chuck for 300mm and standard Bruker sample holder for adjustment) - Motorized slits and fixed slit 2mm primary side (tube), secondary side LynxEye XE Detector - Wafer chuck and standard sample holder - Fully automated - X-ray source: TXS point focus (50kV 50mA) generator installed in the electronic cabinet behind the toolOEM 모델 설명
The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.문서
문서 없음