SUSS MicroTec offers a wide product portfolio of high quality process solutions for the semiconductor industry and related markets. SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding, and photomask processing, complemented by micro-optical components. 

MA 150 is a photolithographic machine equipped with a Hitachi monitor for Wafer alignment processing with size capability of 6” wafer and can be maximized up to 7”.

SUSS MicroTec / KARL SUSS

MA150

Priming + Spin Coating + Spray Coating + Baking + Development
up to 200 mm 

GAMMA

KARL SUSS MA 200 is a Mask Aligners system. the SUSS MA 200 can be used with a 6”-8” wafer size.

MA200

The KARL SUSS ACS 200 is a fully automatic coater/developer system for 200mm wafers. KARL SUSS ACS 200 include HVM and R&D in Advanced Packaging, MEMS and LED. Now on its 3rd generation, the KARL SUSS ACS 200 has the highest process module count of any 200 mm coater / developer on the market.

Automated equipment insures that all process steps are completed in a systematic, reproducible manner without variation inherent with manual operations. The Suss system may be configured with two or more coating systems, up to six hot plate units and an aqueous developer system. Substrates of many sizes, shapes may be processed simultaneously through any desired series of process steps or recipe.

ACS200

"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. 
 The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact).
 
 Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."

MJB3

The MA6 has upgraded optics designed to output in the mid-UV (250nm) range. The lamp is controlled by a CIC 100 constant intensity controller capable of delivering user-selectable UV doses which remain stable during the life of the lamp. Optical sensors monitor the UV output dose and provide feedback to the controller. There are 2 selectable channels. Both channels operate the lamp near its “idle power” (475W) to maximize lamp life. Because the lamp operates in constant intensity mode, the actual power will vary over time as the lamp ages.

The SUSS MA 200CC tools are automatic production mask aligners for making MCM-D substrates. They deliver excellent printing results with photo-BCB, a dielectric material used in MCMs. These aligners are suitable for designs as small as 5 microns and meet future photolithography needs in MCM-D technology. Their large depth of focus enables patterning on uneven surfaces.

MA200CC

MA56

Alignment + Exposure + UV Bonding
up to 200 mm 

MA200 COMPACT

SUSS MA8 mask alignment lithography machine is a lithography application solution developed for the R&D and trial production of 200mm IC back-end process. MA8 can fully meet the powerful functions and flexibility required by the laboratory. The compatibility of the exposure mode fully allows the process developed on the MA8 to be transplanted to the MA200 production mask alignment lithography machine of SUSS , and be applied in actual production.

MA8 can meet the needs of back-end processes, such as passivation and thin film bumping technology. Similarly, thick resist lithography and backside alignment capabilities make MA8 also have great application prospects in microsystem technology. In addition, MA8 is also considered as an ideal tool for communication and optoelectronic applications.

After adopting the low-diffraction exposure system, in addition to high-resolution standard lithography applications, the MA8 mask alignment lithography machine can also complete the following special technologies:

Bond alignment
near-field holographic lithography ,
UV processing
UV curing nanoimprinting, etc.

MA8/BA8

The KARL SUSS MA6/BA6 is a Mask Aligners system. The MA6/BA6 can be used with 6"/150mm wafer sizes.

MA6/BA6

Wafer Bonding + Bond Alignment + Cleaning +  Metal Oxide Removal + Plasma Activation
Up to 200 mm 

ABC200

KARL SUSS MA 150E is a Mask Aligners system and it can be used with 2”-4” wafer size.

MA150E

Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation
Up to 200 mm 

CBC200

MA45

The SUSS PA200 Semiautomatic Probe System is available as two versions, one for high speed (HS) and one for high resolution (HR) applications. They are both very stable, modular and flexible probe systems for wafers and substrates up to 200 mm (8).

PA200

200mm production mask aligner cassette-to-cassette with high throughput of up to 170 wafers/hour in first mask mode.

MA200E

The PA300 is an analytical prober conforming to EN 61010 - 1: 1993-04 which corresponds to UL 3101-1: 1993 and IEC 1010-1: 1992. By means of the PA300 electrical measurements on wafers and substrates up to a diameter of 300mm can be made. The only electrical connection to the measuring object is through the probecard, the probehead and the chuck.

PA300

"The KARL SUSS MA 150CC is a Mask Aligners system. the SUSS MA 150 can be used with 6” wafer size."
150mm production mask aligner cassette-to-cassette with high throughput of up to 170 wafers/hour in first mask mode.

MA150CC

RC8 MS3

PA200 HS 

ACS300

ELP300

DARK BOX

The KARL SUSS MA 8 is a Mask Aligners system. The KARL SUSS MA 8 can be used with a wafer size of 8”.
The SUSS laboratory mask aligners are machines designed for photolithography applications in laboratories and for small-scale production. The MA6 and MA8 machines only differ insignificantly in terms of operation.

The SB8e and the SB6e (SB8e/6e) represent the latest generation technology in substrate bonders offering precision performance and flexibility in a user-friendly, high-quality package. The newly designed and enhanced SB8e/6e are semi-automatic, computer-controlled systems with both vacuum- and pressurecontrolled atmosphere capability featuring an ergonomic load/ unload station. The SB8e/6e delivers superior post bond alignment accuracy resulting from precision mechanics, uniform force capability and leading temperature control. When matched with SUSS’ bond aligners, BA8/6, they offer enabling capability for MEMS, 3-D interconnects, and opto-electronics. This generation’s bond chamber and tooling supports all types of bond processes with optimization especially for thermocompression bonding and the flexibility to switch to anodic bond tooling. The flexibility of these bond systems make them ideal and economical for laboratories and small series production. Yet, combined with SUSS’ patent-pending low temperature plasma activation module these systems offer enabling technology for fusion bonding of SOI, III/V, and SiGe compounds at temperatures down to 200°C.

SB6e

CB200M

MA25

Available as a completely automated system to level, align and package components down to 200 µm, the FC150 supports the complete range of bonding applications, including optoelectronics and MCM. The SUSS FC150 Bonder offers you the latest evolution in bonding technologies: ultrasonic/thermo-sonic, laser welding. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The FC150 can be equipped with tooling enabling all known bonding processes (i.e. Thermocompression, Adhesives, Reflow...) to perform wafer-to-wafer bonding, with round or square substrate sizes up to 100 mm diameter at +/- 1 µm post-bonding accuracy

FC-150

MA8/BA8 Gen 3

The MA 1006 TSA, MA 1006 TSA/BSA and MA 1006 TSA/I R mask aligners are designed for high resolution photolithography in a laboratory, development, or pilot production environment. They offer unsurpassed flexibility in the handling of irregularly shaped substrates of differing thickness as well as standard size wafers up to 150mm diameter. All mask aligner of the MA 1006 series are partly motorised with a very easy-to-use user panel. The adjustment is done by micrometer screws. Both, screw and user panel are designed for best ergonomic position.  For most accurate alignment, each step of alignment can be viewed on a monitor using a splitfield microscope in combination with a CCD camera for bottom side alignment and a high resolution splitfield microscope for top side alignment. The MA 1006 is a compact mask aligner in a modular assembly design which allows a very easy maintenance procedure. The functional groups are easily accessible and the subassemblies can be quickly exchanged. 

MA1006

CT 62

"The ACS200Plus is a versatile spin coating and developing system designed for round wafers (2 inches to 200 mm) and square substrates (2 inches to 6 inches). It excels in various techniques like spin coating, spray coating, baking, and developing for applications including thin/thick adhesives and photosensitive polymers. It meets the demands of cutting-edge photoresist processes in optoelectronics, MEMS, and advanced packaging.

With its modular design, the ACS200Plus offers flexibility for R&D, trial production, and mass production. Configurable with 2, 4, or 6 process modules around a central manipulator, it allows for scalability by adding additional modular units.

The optional GYRSET module creates a uniform coating environment by minimizing disturbances and forming solvent-rich coatings. For a comprehensive lithography solution, the ACS200Plus can be combined with the MA200Compact mask alignment lithography machine to form the integrated LithoFab200 system."

ACS200 Plus

GAMMA 80

260MS022

FC-250

Semi-automated system up to 300 mm
Mechanical Debonding 

DB12T

 Priming + Spin Coating + Puddle Development + Baking
up to 200mm

DELTA80

MA/BA8 Gen3

Voltage: 400 VAC / 50 Hz / 16 A
Compressed air: 5 - 6 bar / tube OD 8 mm
Vacuum: min. - 0.7 bar / tube OD 8 mm
Nitrogen: 4.5 bar / tube OD 8 mm
Exhaust: OD 100 mm (3x)

DELTA 80 T2

With the DSM200, SUSS MicroTec has developed a new automated metrology system for all emerging front to backside alignment applications. The cassette-cassette front-to-back alignment metrology system is the ideal tool for verifying alignment accuracy on wafers from 2 inch to 200mm. Incorporating state-of-the-art pattern recognition technology, the DSM200 offers the highest measurement accuracy of 0.2 microns at 3 sigma on a fully automated platform with minimized operator intervention. Based on the latest production platform of the SUSS MA200Compact Mask Aligner, the DSM200 provides reliable and accurate metrology for double-sided alignment and exposure applications frequently used in the manufacturing of MEMS devices, power semiconductors and optoelectronics.

DSM200

RC8 THP

FALCON

KARL SUSS MA8/BA6 is capable of handling upto 200mm substrates and allows for pattern printing on both sides of the substrates. Applications for the Karl Suss MA8/BA6 include: MEMS; ACADEMIA and 3D STRUCTURING. The machinery is equiped with 3 alllignment modes- MEMS, ACADEMIA, 3D STRUCTURING.

MA8/BA6

Easy to use and compact in size the SUSS MicroTec MJB4 represents the perfect system for laboratories and small volume production. As an inexpensive photolithography solution the MJB4 has set industry standards specifically for processing of small substrates and pieces up to 100 mm. Equipped with a reliable, high precision mask alignment and high resolution printing capability in the submicron range the MJB4 demonstrates a performance unsurpassed by any comparable machine

MJB4

MJB 45S

Manual Spray Coater for High Topographies
SUSS MicroTec AS8/AS12 is the ideal tool for R&D and low-volume fabrication. Substrates up to 200 mm or 300 mm in diameter and square substrates up to 6" edge length can be processed. The system can be equipped with up to two separate spray dispense systems. The sophisticated resist supply system offers unmatched process stability and reproducibility. All spray and cleaning parameters can be programmed in the recipe.
The manual product line of SUSS MicroTec coaters offers easy recipe transfer to automated platforms.

MA 24

The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm.

MA 4/6

SB8e

DELTA 80T	

DELTA 20T

Automated system up to 200 mm
Mask Alignment + Exposure

MA200 Gen3

RA 120

SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration.

SB8 Gen2 - from pieces up to 200mm wafers.

SB8 Gen2

Alignment metrology for R&D and high-volume production.

DSM8 Gen2

The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.

ACS200 Gen3

This mask aligner provides high resolution photolithography and can process samples in a variety of shapes and sizes. The KARL SUSS MJB 3 UV400 processes wafers up to 3” in diameter and its resolution can reach 1-2 microns. Configuration includes 350W mercury short-arc lamp, high precision stage with alignment accuracy up to 0.25 microns, high resolution contact exposure mode, high precision alignment with microscope manipulator, and special substrate chucks for irregular materials, thick substrates, and hybrids.

MJB3 UV400

The LD12 debond module supplements the SUSS MicroTec product portfolio for laser-based wafer processing. It is based on the application of an excimer laser which uses nanosecond, high energy 308 nm laser pulses to break the chemical bonds in a release layer or the actual adhesive which holds the glass carrier to the device wafer. This excimer laser based debonding process does not produce significant thermal stress and therefore ensures the integrity of sensitive components. The LD12 module is designed to debond glass carriers from full thickness wafers or thinned 200 mm and 300mm wafers which are mounted on tape frames.
Using the LD12 enables high throughput debonding for applications in 2.5D and 3D integration, 3D MEMS and CIS, as well as in the field of power devices to be carried out quickly and carefully.

LD12

SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration.

SB6 Gen2 - from pieces up to 150mm wafers.

SB6 Gen2

Coating + Developing + Alignment + Exposure
up to 200 mm 

LithoFab200

Flexible Solution for Aqueous Development and Cleaning
SUSS MicroTec’s semi-automated wet-processing system AD12 offers superior cleaning and developing functions for aqueous media applications. The single-wafer processing platform serves pieces, wafer sizes up to 300 mm, square substrates up to 230 x 230 mm and tape frames for wafers up to 300 mm. Its ability to handle various media and processes gives the flexibility needed for switching between applications and makes the tool first choice for research environment and small scale production.

AD12

The M6000L combines exceptional process capability and yield in a single wafer system that prevents waste metal redeposition that is often a problem for traditional batch processes. Its compact footprint, approximately 1200 mm by 1200 mm, low chemical consumption, and potential for high process material utilization reduces cost of ownership even further for metal lift-off processes.

M6000L

260MS143-02

MA100G

SUSS MicroTec’s semi-automated wet-processing system SD12 offers superior cleaning and lift-off functions for solvent media applications. The single-wafer processing platform serves pieces, wafer sizes up to 300 mm, square substrates up to 230 x 230 mm and tape frames for wafers up to 300 mm. Its ability to handle various media and processes gives the flexibility needed for switching between applications and makes the tool first choice for research environment and small scale production.

SD12

 The DSC300 Gen3 Scanner delivers 300 mm wafer throughput of > 90 wph at 400 mJ/cm2 and > 80 wph at 1000 mJ/cm2.

DSC300 Gen3

Laboratory Spin Coat and Develop Solution for Wafers up to 150 and 200mm
SUSS MicroTec‘s LabSpin platform represents the next generation of manual spin coater and developer systems that have been developed specifically for laboratory and R&D. Designed for a variety of photolithography chemicals, LabSpin systems provide uniform, precise and repeatable spin coating results on the wafer through its advanced process chamber design.

LABSPIN6

MA150ML

MA150M

MA4 SERIES III

Resist Coat and Develop Platform
The RCD8 semi-automated coater and developer platform is an outstanding tool for R&D and small-scale production and can be custom configured for each application.

The design of the RCD8 semi-automated coater and developer platform draws on SUSS MicroTec's expertise in large-scale production. It is built using the same high-quality components as SUSS MicroTec's full production assemblies. As such, the RCD8 coater and developer platform delivers top application quality with maximum reliability and repeat accuracy. Application-specific substrate chucks allow for the processing of various substrate materials and shapes. These range from square substrates measuring up to 150 x 150 mm and standard wafers up to 200 mm to special shapes up to a maximum size of 200 mm.

RCD8

AS12

Automated system up to 300 mm (Excimer Laser) 
Alignment + Ablation + Laser-Assisted  Debonding + Laser Seed Layer  Removal

ELP300 Gen2

The Labcluster for Laboratories, Start-Ups, and Small Production
SUSS MicroTec’s Manual Coating System (MSC8) offers the latest generation of coating and aqueous developing techniques in a unique cluster configuration. It is designed and assembled to provide the greatest variety of functionalities on the smallest cleanroom footprint. Technologies which have proven themselves in SUSS MicroTec high-volume production tools are thus accessible to laboratories, start-ups, and small-scale production through the MCS8.

MCS8

CB200

SB8L

The SUSS SB6L is the ideal complement to the SUSS Bond Aligner. It is a universal tool for wafer bonding processes for micro electro-mechanical system applications such as: Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding (AB) (SFB), Thermal Compression Bonding (TCB) (ADB) After alignment on the Bond Aligner, the substrate stacks are mechanically clamped using the transport fixture for further processing in the Substrate Bonder. 

SB6L

It is a high force bonder, from 10 gram-force up to 400 kilogram-force depending on the head configuration. This device bonder can operate as a "classic" one but also with a confinement chamber, using an acid gas mixture and/or reduced pressure. This permits much better quality of bonding process, resulting in good electrical conductivity and high mechanical resistance for more reliable components. Substrate size can be up to 300mm wafer.

FC-300

PH120

Substrates: 
50mm - 200mm (round)
3inch - 9inch (square) piece chuck


HMx SQUARE 9

SUSS AltaSpray® topography coating modules are available for the ACS200 Gen3 and ACS300 Gen2 platforms. The AltaSpray module allows processing of wafers with diameters of 200mm and 300mm as well as squares up to 8" edge length. All AltaSpray coater modules are can be equipped with up to two separate spray dispense systems.

ALTASPRAY

MODEL 505

XBC300

MA150RH

SUSS MicroTec's manual hot plate HP8 has been developed specifically to meet the requirements of R&D work and small scale production. The 200 mm hot plate (HP8) offers homogeneous temperature distribution as well as heating ramps with high repeating accuracy to ensure constant and stable process results.

UV NIL

SCIL

ACS300 Plus

MA/BA6 Gen3

The actively chilled, recipe-based cool plate offers a closed cooling chamber preventing contamination on the wafer.
Manual system up to 200 mm.

MA150RSH

The KARL SUSS MA 150EL is a Mask Aligners system. The MA 150EL can be used with Wafer Size of 6”.

SUSS MicroTec / KARL SUSS

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MA150

GAMMA

MA200

ACS200

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