설명
Rework target L/S 10um or above; maximum copper foil thickness <70um; PCB MAX 660×610 mm; laser type YAG LASER, wavelength 532 nm, high-energy shaping, near-vertical irradiation, processing spot diameter 3 µm. Function Description: Uses laser irradiation to remove short circuits and residual copper on advanced HDI and IC substrates, including CSP, FC-CSP, BGA, and FC-BGA applications. Even for high-density substrate circuit designs, Ultra PerFix 120 can complete precise rework within 1 minute. When analysis reaches 10 µm, scrap can be minimized as much as possible.환경 설정
환경 설정 없음OEM 모델 설명
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.문서
문서 없음
카테고리
AOI
마지막 검증일: 26일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
58896
웨이퍼 사이즈:
알 수 없음
빈티지:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / ORBOTECH
ULTRA PERFIX 120
카테고리
AOI
마지막 검증일: 26일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
58896
웨이퍼 사이즈:
알 수 없음
빈티지:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Rework target L/S 10um or above; maximum copper foil thickness <70um; PCB MAX 660×610 mm; laser type YAG LASER, wavelength 532 nm, high-energy shaping, near-vertical irradiation, processing spot diameter 3 µm. Function Description: Uses laser irradiation to remove short circuits and residual copper on advanced HDI and IC substrates, including CSP, FC-CSP, BGA, and FC-BGA applications. Even for high-density substrate circuit designs, Ultra PerFix 120 can complete precise rework within 1 minute. When analysis reaches 10 µm, scrap can be minimized as much as possible.환경 설정
환경 설정 없음OEM 모델 설명
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.문서
문서 없음