설명
Rework target: L/S 10um or above. Maximum copper foil thickness <70um. PCB MAX 660×610mm. Laser type: YAG LASER, wavelength 532nm, high-energy shape, near-vertical irradiation, processing spot diameter 3µm. Function Description: Uses laser irradiation to eliminate short circuits and copper residue on advanced HDI and IC substrates, including CSP, FC-CSP, BGA and FC-BGA applications. Even for high-density substrate circuit designs, Ultra PerFix 120 can complete precise rework within 1 minute. When analysis reaches 10µm, scrap can be minimized.환경 설정
환경 설정 없음OEM 모델 설명
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.문서
문서 없음
카테고리
AOI
마지막 검증일: 26일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
58895
웨이퍼 사이즈:
알 수 없음
빈티지:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / ORBOTECH
ULTRA PERFIX 120
카테고리
AOI
마지막 검증일: 26일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
58895
웨이퍼 사이즈:
알 수 없음
빈티지:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Rework target: L/S 10um or above. Maximum copper foil thickness <70um. PCB MAX 660×610mm. Laser type: YAG LASER, wavelength 532nm, high-energy shape, near-vertical irradiation, processing spot diameter 3µm. Function Description: Uses laser irradiation to eliminate short circuits and copper residue on advanced HDI and IC substrates, including CSP, FC-CSP, BGA and FC-BGA applications. Even for high-density substrate circuit designs, Ultra PerFix 120 can complete precise rework within 1 minute. When analysis reaches 10µm, scrap can be minimized.환경 설정
환경 설정 없음OEM 모델 설명
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.문서
문서 없음