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APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
설명
Wafer Testing And Metrology
환경 설정
환경 설정 없음
OEM 모델 설명
The AMAT VeraSEM 3D is an advanced semiconductor imaging system introduced by Applied Materials. It offers three-dimensional imaging capabilities for chip features as small as 0.10 micron, allowing users to gain valuable insights into semiconductor structures with high precision. The system's enhanced efficiency makes it a powerful tool for semiconductor analysis and research.
문서

문서 없음

PREFERRED
 
SELLER
카테고리
CD-SEM

마지막 검증일: 60일 이상 전

Buyer pays 12% premium of final sale price
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

101264


웨이퍼 사이즈:

12"/300mm


빈티지:

2023


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

APPLIED MATERIALS (AMAT)

VERASEM 3D

verified-listing-icon
검증됨
카테고리
CD-SEM
마지막 검증일: 60일 이상 전
listing-photo-faa1f4f2b09e48198a8538f0e0195430-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75657/faa1f4f2b09e48198a8538f0e0195430/3325dad73eea483fbcfa56c01ed1b25d_1ss_mw.png
listing-photo-faa1f4f2b09e48198a8538f0e0195430-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75657/faa1f4f2b09e48198a8538f0e0195430/b33ac4efab9b4131b8259ca8f90a9884_3ss_mw.png
listing-photo-faa1f4f2b09e48198a8538f0e0195430-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75657/faa1f4f2b09e48198a8538f0e0195430/564f9fc1a6544387859d951e02e987c3_2ss_mw.png
Buyer pays 12% premium of final sale price
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

101264


웨이퍼 사이즈:

12"/300mm


빈티지:

2023


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Wafer Testing And Metrology
환경 설정
환경 설정 없음
OEM 모델 설명
The AMAT VeraSEM 3D is an advanced semiconductor imaging system introduced by Applied Materials. It offers three-dimensional imaging capabilities for chip features as small as 0.10 micron, allowing users to gain valuable insights into semiconductor structures with high precision. The system's enhanced efficiency makes it a powerful tool for semiconductor analysis and research.
문서

문서 없음