설명
설명 없음환경 설정
CD SEM – Stage performance resolution = 1nm (xy) / 4nm (z) with 2µm accuracy – Image resolution = 1.8nm @ 500eV – Side wall imaging = 12 deg tilt at 4 directions – HAR imaging = 1:30 features – Accelerating voltage = 0.2kV to 2.5kV – Extraction V up to 4KV, Probe current = 5pA – 500pA – 4 wafer cassette loading portsOEM 모델 설명
The Applied VeritySEM 2 Metrology system offers unparalleled precision and maximum production throughput, measuring 45nm gate, low-k, and ArF resist features with 3Å accuracy, essential for 45nm device production. Enhanced by its advanced automation, this system drastically reduces the need for tool operators and cuts down on CD-SEM tools in fabs. A standout feature, the OPC Check, automates the Optical Proximity Correction mask qualification, catering to evolving chipmaker needs. Proprietary SEM technology ensures speedy electron movement and precise measurements, resulting in top-notch resolution.문서
문서 없음
APPLIED MATERIALS (AMAT)
VeritySEM 2
검증됨
카테고리
CD-SEM
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
42944
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
APPLIED MATERIALS (AMAT)
VeritySEM 2
카테고리
CD-SEM
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
42944
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
CD SEM – Stage performance resolution = 1nm (xy) / 4nm (z) with 2µm accuracy – Image resolution = 1.8nm @ 500eV – Side wall imaging = 12 deg tilt at 4 directions – HAR imaging = 1:30 features – Accelerating voltage = 0.2kV to 2.5kV – Extraction V up to 4KV, Probe current = 5pA – 500pA – 4 wafer cassette loading portsOEM 모델 설명
The Applied VeritySEM 2 Metrology system offers unparalleled precision and maximum production throughput, measuring 45nm gate, low-k, and ArF resist features with 3Å accuracy, essential for 45nm device production. Enhanced by its advanced automation, this system drastically reduces the need for tool operators and cuts down on CD-SEM tools in fabs. A standout feature, the OPC Check, automates the Optical Proximity Correction mask qualification, catering to evolving chipmaker needs. Proprietary SEM technology ensures speedy electron movement and precise measurements, resulting in top-notch resolution.문서
문서 없음