설명
P-5000 Mark II DLH SACVD환경 설정
CVD WxZ Tungsten SACVD (Chemical Vapor Deposition) Deposition Equipment Software: b6.02 MF: P5000 Mark II Qty 4 - DLH SACVD: TEOS Deposition Chuck: Anodized Aluminum Ozonators (4 Astex) with In usa ozone monitor. Shumacher TEOS cabinet MFCs: 28 Horiba Z500 Digital MFCs Robot: ROBOT ASSY 8 IN AMAT 5000 Dry Pumps: EDWARDS iqdp80/qmb250 STACK Qty 4. Edwards IQDP80 Qty 1 Chillers: AMAT Heatex 1, Neslab HX300 Upgrades: PLIS,Brooks Digital Baratron Qty 8, V440 SBCOEM 모델 설명
The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.문서
문서 없음
카테고리
CVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
125404
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
1995
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
APPLIED MATERIALS (AMAT)
P5000 CVD
카테고리
CVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
125404
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
1995
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
P-5000 Mark II DLH SACVD환경 설정
CVD WxZ Tungsten SACVD (Chemical Vapor Deposition) Deposition Equipment Software: b6.02 MF: P5000 Mark II Qty 4 - DLH SACVD: TEOS Deposition Chuck: Anodized Aluminum Ozonators (4 Astex) with In usa ozone monitor. Shumacher TEOS cabinet MFCs: 28 Horiba Z500 Digital MFCs Robot: ROBOT ASSY 8 IN AMAT 5000 Dry Pumps: EDWARDS iqdp80/qmb250 STACK Qty 4. Edwards IQDP80 Qty 1 Chillers: AMAT Heatex 1, Neslab HX300 Upgrades: PLIS,Brooks Digital Baratron Qty 8, V440 SBCOEM 모델 설명
The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.문서
문서 없음