설명
Hardware Configuration : - 3 Dep. PLIS (Precision Liquid Injection System) Chamber - 1 Sputter Etch Chamber - Parts and Modules : (1) 1-Delatech Scrubber Model 859(non-recirc) (2) 1-Main power box w/4 ENI RF Generators (3) 1-Delta RF generator rack w/3 RFPP generators (4) 1-AMAT '0' Heat exchanger (5) 1-Front monitor (6) 1-Rear monitor (7) 3-50x20 Ebara pumps (Refurbished) (8) 2-40x20 Ebara pumps (Refurbished) (9) 1-Mini controller환경 설정
SiO2 CVD (including dry pumps (5 Ea.), Scrubber, etc.)OEM 모델 설명
The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.문서
문서 없음
카테고리
CVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
51182
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
APPLIED MATERIALS (AMAT)
P5000 CVD
카테고리
CVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
51182
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Hardware Configuration : - 3 Dep. PLIS (Precision Liquid Injection System) Chamber - 1 Sputter Etch Chamber - Parts and Modules : (1) 1-Delatech Scrubber Model 859(non-recirc) (2) 1-Main power box w/4 ENI RF Generators (3) 1-Delta RF generator rack w/3 RFPP generators (4) 1-AMAT '0' Heat exchanger (5) 1-Front monitor (6) 1-Rear monitor (7) 3-50x20 Ebara pumps (Refurbished) (8) 2-40x20 Ebara pumps (Refurbished) (9) 1-Mini controller환경 설정
SiO2 CVD (including dry pumps (5 Ea.), Scrubber, etc.)OEM 모델 설명
The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.문서
문서 없음