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LAM RESEARCH / NOVELLUS CONCEPT THREE "C3" ALTUS
  • LAM RESEARCH / NOVELLUS CONCEPT THREE "C3" ALTUS
  • LAM RESEARCH / NOVELLUS CONCEPT THREE "C3" ALTUS
  • LAM RESEARCH / NOVELLUS CONCEPT THREE "C3" ALTUS
설명
WCVD(2 chamber)
환경 설정
환경 설정 없음
OEM 모델 설명
Concept Three ALTUS is a 300mm process module that delivers leading productivity and technology for contact and local interconnect applications. It uses Pulsed Nucleation Layer (PNL™) technology to integrate a high throughput nucleation layer with chemical vapor deposition (CVD bulk deposition). The Multi-Station Sequential Deposition (MSSD) architecture enables the nucleation layer and CVD fill to be performed within the same ALTUS chamber. This results in highly conformal tungsten films with improved film properties, benchmark productivity, and superior production availability. The integrated PNL and CVD approach produces the lowest Cost of Ownership tungsten deposition solution in the industry.
문서

문서 없음

PREFERRED
 
SELLER
카테고리
CVD

마지막 검증일: 60일 이상 전

Buyer pays 12% premium of final sale price
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

118497


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

LAM RESEARCH / NOVELLUS

CONCEPT THREE "C3" ALTUS

verified-listing-icon
검증됨
카테고리
CVD
마지막 검증일: 60일 이상 전
listing-photo-3d270ee88cb64b00922388f3dab1256a-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Buyer pays 12% premium of final sale price
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

118497


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
WCVD(2 chamber)
환경 설정
환경 설정 없음
OEM 모델 설명
Concept Three ALTUS is a 300mm process module that delivers leading productivity and technology for contact and local interconnect applications. It uses Pulsed Nucleation Layer (PNL™) technology to integrate a high throughput nucleation layer with chemical vapor deposition (CVD bulk deposition). The Multi-Station Sequential Deposition (MSSD) architecture enables the nucleation layer and CVD fill to be performed within the same ALTUS chamber. This results in highly conformal tungsten films with improved film properties, benchmark productivity, and superior production availability. The integrated PNL and CVD approach produces the lowest Cost of Ownership tungsten deposition solution in the industry.
문서

문서 없음