설명
Dark Field. Software version 5.3.17, single open cassette handler. SECS II/GEM communication interface, include RTC option, 75MW 488nm Argon Laser, Multi Channel collection optics system with independent programmable spatial filters 10um single incident spot optics, additional 7um and 5 um spot size, flat panel display (AIT 2), Fold down keyboard tray with built-in mouse.환경 설정
환경 설정 없음OEM 모델 설명
The AIT II is a patterned wafer inspection system for 150 to 300 mm wafers that provides fast, accurate feedback on process tool performance. It offers an integrated solution for automated defect classification and analysis, quickly turning defect data into yield-enhancing information. It is designed for flexibility in films, etch, photo, and CMP applications and offers advantages such as reducing process excursions, increasing overall equipment effectiveness, improving yield stability/predictability, and augmenting line monitoring.문서
문서 없음
KLA
AIT II
검증됨
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
24647
웨이퍼 사이즈:
8"/200mm
빈티지:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
KLA
AIT II
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
24647
웨이퍼 사이즈:
8"/200mm
빈티지:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Dark Field. Software version 5.3.17, single open cassette handler. SECS II/GEM communication interface, include RTC option, 75MW 488nm Argon Laser, Multi Channel collection optics system with independent programmable spatial filters 10um single incident spot optics, additional 7um and 5 um spot size, flat panel display (AIT 2), Fold down keyboard tray with built-in mouse.환경 설정
환경 설정 없음OEM 모델 설명
The AIT II is a patterned wafer inspection system for 150 to 300 mm wafers that provides fast, accurate feedback on process tool performance. It offers an integrated solution for automated defect classification and analysis, quickly turning defect data into yield-enhancing information. It is designed for flexibility in films, etch, photo, and CMP applications and offers advantages such as reducing process excursions, increasing overall equipment effectiveness, improving yield stability/predictability, and augmenting line monitoring.문서
문서 없음