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KLA SURFSCAN SP2
  • KLA SURFSCAN SP2
  • KLA SURFSCAN SP2
  • KLA SURFSCAN SP2
설명
One 300mm load port and 200mm load port
환경 설정
환경 설정 없음
OEM 모델 설명
The Surfscan SP2 is an unpatterned wafer surface inspection tool that uses UV laser technology, darkfield optics, and advanced algorithms to detect defects as small as 30nm. It provides high sensitivity detection on engineered substrates and has a significant throughput increase over the prior-generation tool. It offers a single tool solution for three technology nodes and has comprehensive wafer surface inspection capabilities. It also enables faster root-cause analysis with improved coordinate accuracy and real-time defect classification capability.
문서

문서 없음

카테고리
Defect Inspection

마지막 검증일: 18일 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

119549


웨이퍼 사이즈:

8"/200mm, 12"/300mm


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

KLA

SURFSCAN SP2

verified-listing-icon
검증됨
카테고리
Defect Inspection
마지막 검증일: 18일 전
listing-photo-0c4a3228bab3457caaf8a5c87ef9ca50-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

119549


웨이퍼 사이즈:

8"/200mm, 12"/300mm


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
One 300mm load port and 200mm load port
환경 설정
환경 설정 없음
OEM 모델 설명
The Surfscan SP2 is an unpatterned wafer surface inspection tool that uses UV laser technology, darkfield optics, and advanced algorithms to detect defects as small as 30nm. It provides high sensitivity detection on engineered substrates and has a significant throughput increase over the prior-generation tool. It offers a single tool solution for three technology nodes and has comprehensive wafer surface inspection capabilities. It also enables faster root-cause analysis with improved coordinate accuracy and real-time defect classification capability.
문서

문서 없음