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AD838CAOEM 모델 설명
The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types.문서
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ASM
AD838
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
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제품 ID:
76768
웨이퍼 사이즈:
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빈티지:
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
AD838CAOEM 모델 설명
The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types.문서
문서 없음