설명
Solidifying machine and laminating machine. AD838 is an automatic high speed epoxy die bonder with up to 4"(101.6 mm) substrate width handling capability, It is highly flexible in handling wide range of die sizes for your IC and discrete packages. Together with high precision linear motorizing system, patented bond head system, dual dispensing system and advanced inspection system, AD838 must be your only choice for die attach process.환경 설정
환경 설정 없음OEM 모델 설명
The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types.문서
문서 없음
ASM
AD838
검증됨
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
79228
웨이퍼 사이즈:
4"/100mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
ASM
AD838
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
79228
웨이퍼 사이즈:
4"/100mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Solidifying machine and laminating machine. AD838 is an automatic high speed epoxy die bonder with up to 4"(101.6 mm) substrate width handling capability, It is highly flexible in handling wide range of die sizes for your IC and discrete packages. Together with high precision linear motorizing system, patented bond head system, dual dispensing system and advanced inspection system, AD838 must be your only choice for die attach process.환경 설정
환경 설정 없음OEM 모델 설명
The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types.문서
문서 없음