설명
설명 없음환경 설정
Dual Dispensing/Dropping Capability: Supports two adhesive dispensing modes to accommodate diverse packaging process requirements. Intelligent Alignment System: Features integrated optical alignment functionality for panel-level die bonding operations with micron-level precision. Pressure-Compensating Anvil: Incorporates self-compensating clamp pressure design to ensure consistent die bonding pressure. Direct Ceramic Substrate Feeding: Optimized for ceramic substrates, supporting high thermal conductivity material packaging Lead Frame Handling: Compatible with copper-iron-phosphorus, copper-nickel-silicon, and other alloy lead frames, meeting material requirements of tensile strength >450MPa and conductivity >80% Semiconductor Chips: Supports IC chip packaging, including re-bonding options. Lead Frame Materials: Compatible with etched/stamped frames, processing chip pads and pin structures. Bonding Materials: Adaptable to gold/aluminum/copper wire bonding materials, supporting lead-free eco-friendly processes. Semiconductor chips: Supports IC chip packaging, including die bonding and die attachment process options Lead frame materials: Compatible with etched/stamped frames, accommodating chip pads and pin structures Packaging resin materials: Compatible with gold wire/aluminum wire/copper wire bonding materials, supporting lead-free environmentally friendly processesOEM 모델 설명
The AD838L is a series of die bonders from ASMPT. It has an exclusive material handling capability, dragging-free indexing, and an advanced bond head design with patented technology that achieves high UPH. It can handle extra large substrates up to 300 mm x 100 mm and has a high precision bonding option that achieves ±15 μm @ 3σ XY placement accuracy.문서
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ASM
AD838L
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
134418
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available