설명
Flip Chip Die Bonder환경 설정
- 0 µm accuracy - Up to 12k UPH - 230 VOEM 모델 설명
The ESEC 2100 FC hS is the third generation of the highly regarded High-Speed Flip Chip platform, designed to handle a wide array of Flip Chip applications, including FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and emerging packages like CSP-LED. This advanced bonder delivers exceptional ease of operation, providing seamless production control and assistance문서
문서 없음
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 13일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
152704
웨이퍼 사이즈:
12"/300mm
빈티지:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100 FC hS
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 13일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
152704
웨이퍼 사이즈:
12"/300mm
빈티지:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Flip Chip Die Bonder환경 설정
- 0 µm accuracy - Up to 12k UPH - 230 VOEM 모델 설명
The ESEC 2100 FC hS is the third generation of the highly regarded High-Speed Flip Chip platform, designed to handle a wide array of Flip Chip applications, including FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and emerging packages like CSP-LED. This advanced bonder delivers exceptional ease of operation, providing seamless production control and assistance문서
문서 없음