설명
BESI Datacon 2200 EVO Flexible Multi-Chip Die Bonder High accuracy and high productivity DOM: 2019 Less than 100 operating hours...VERY LOW USE! Wafer Table Tool Changer Unit 7 Slots Main – Musashi Super Sigma V2 Internal Vacuum Pump P-part at Main AXIS Microscope 12" (FF-123) adapter for 2" and/or 4" Wafflepacks and Gelpaks (4x 2" and 2x 4") 2" WP-Adapter (12"-FF123) - 23 up - side clamp (any WT) 4" WP-Adapter - (12"-FF123) - 7 up - side clamp (std WT) 2" GP-Adapter - (12"-FF123) - 22 up - (any WT) 4" GP-Adapter - 12" (FF123) - 7 up - (std WT)환경 설정
환경 설정 없음OEM 모델 설명
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.문서
문서 없음
BESI / DATACON
2200 EVO
검증됨
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 10일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
118453
웨이퍼 사이즈:
알 수 없음
빈티지:
2019
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
BESI / DATACON
2200 EVO
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 10일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
118453
웨이퍼 사이즈:
알 수 없음
빈티지:
2019
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
BESI Datacon 2200 EVO Flexible Multi-Chip Die Bonder High accuracy and high productivity DOM: 2019 Less than 100 operating hours...VERY LOW USE! Wafer Table Tool Changer Unit 7 Slots Main – Musashi Super Sigma V2 Internal Vacuum Pump P-part at Main AXIS Microscope 12" (FF-123) adapter for 2" and/or 4" Wafflepacks and Gelpaks (4x 2" and 2x 4") 2" WP-Adapter (12"-FF123) - 23 up - side clamp (any WT) 4" WP-Adapter - (12"-FF123) - 7 up - side clamp (std WT) 2" GP-Adapter - (12"-FF123) - 22 up - (any WT) 4" GP-Adapter - 12" (FF123) - 7 up - (std WT)환경 설정
환경 설정 없음OEM 모델 설명
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.문서
문서 없음