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설명
No missing parts환경 설정
Specifications: -X/Y placement accuracy: ± 8 µm @ 3 sigma -Bond force: 200 - 5,000g (50 - 5,000g option) -Die size: 0.3 - 20mm (Fast CUC mode <11mm only) -Die thickness: 50µm - 3mm, thinner on request -Wafer size: 4" - 12" (on 8" or 12" wafer frames) -Substrate types: FR4, ceramic, BGA, strip, flex, boat, leadframe -Working range: 13" x 8" -Flux film thickness: Various cavity plates available -Size: 1,600 mm x 1,200 mm x 1,540mm (W x D x H) -Weight: 2,000 kg -UPH: up to 8,800 (application dependant) -Vision system: 4MP, 12 x 12mm FOV Options: Substrate / Strip Handling • Input/output buffer • Magazine loader/unloader ML1 Vision system: • RGB lighting • OCR recognition for substrates Software: • Substrate/Strip/TU-Mapping (Semi S12, S14 in G84 and E142) • Pseudo X-Ray • Flip and P&P Tool Inspection • Needle Hole Inspection • Eject Tool Needle Inspection • Eject Tool Cap Inspection • Ejection System Live Cam • SECS GEM Parameter Provider • Wafermap Verification by Border Component • Configure User Level • Advanced Flux Imprint Check • Chipping Inspection • Auto Illumination • Distributed Bonding • Single Component Tracking • Lot Management • Complete bonding • Custom slow travel speed/distance • Measure component spacing • Measuring component bench • Fluxlevel detection Component presentation: • Wafer stretcher (for 8" or 12" frames) • Various stretch adapters (for metal and plastic frames) • Wafer table rotation Component handling system: • Upgraded ionizers for TS-input-area and Eject-area) • Low bondforce kit (0.5 - 50N) • Pneumatic terminal Others: • External vacuum pump • Uninterruptable power supply • ALPS Host computerOEM 모델 설명
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.문서
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
102801
웨이퍼 사이즈:
알 수 없음
빈티지:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
BESI / DATACON
2200 EVO
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
102801
웨이퍼 사이즈:
알 수 없음
빈티지:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available